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Apex - Expo IPC会议 - 内华达州 –拉斯维加斯

SEICA Inc. 公司将于4月7日星期三下午3：30-4：30参加2010 IPC's Apex海报展

The 2010 IPC Apex Expo™ took place in Las Vegas, NV.  While attendance was not as high compared to previous years, the leads were more qualified.  The days started off busy and slowed down in the afternoon, probably because attendees wanted to get a head start on the slot machines! 
The systems showcased this year were the Pilot V8 Flying Prober, the Aerial M4 Flying Prober, which featured the innovative IC Thermal Detection Unit, and the Firefly Selective Soldering System.  Interest was high on all systems, with the majority of the focus being on the Firefly.  Kris Carlson, Sales Support Engineer, was kept quite busy with the numerous demonstrations he was giving on the Firefly.  Robert Peet, Sales Support Manager and Mike Casper, Sales Support Engineer, were demonstrating the Aerial M4 and the Pilot V8.  Luca Corli, Sales & Marketing Assistant Director of Seica S.p.A., joined us from Italy to do demonstrations on the systems as well.
David Sigillo, General Manager, and David Levine, National Sales Manager, were highly involved in meeting with potential customers and making sure they knew everything Seica has to offer.  Renate Fritz, full of energy as always, kept up with the editors as she went from one meeting to the next.  Cristiana Nitu, Marketing & Sales Assistant, collected leads and made sure that people knew the hand sanitizer spray giveaway was not a breath spray, as some thought.  Crystal Meneses, Executive Assistant, greeted attendees with a kind smile as she made sure they had a great time playing the Wii Archery game.  Congratulations to the winner of our GPS contest, Joe Perault of Speedline, for getting an impressive high score while trying out his archery skills at the advanced level!
To start the trade show off right, Seica held its annual Sales Meeting for the sales representatives.  The meeting was well attended and filled with informative knowledge on upcoming events, new and current products and valuable sales tools.  During the meeting, Crystal Meneses, David Levine and Mike Casper were congratulated for their five years of employment at Seica, Inc.
A warm thank you is extended to the Seica team and representatives for another great trade show. We all look forward to doing it again next year!

 

PREVIEW

 IPC's Apex 2010 poster presentations - Wednesday 7 April - 3.30-4.30pm - Dave Sigillo, SEICA Inc. General Manager,  will present "Detecting Faulty in Repair Depots"

 To read more   Seica SpA Develops Thermal SCAN For Their Line of Aerial Flying Probers

Seica has recently introduced "flying pyrometers" on its line of Aerial flying probers. There are two pyrometers, one positioned on both sides of a unit under test to detect thermal profiles of ICs under power. The purpose is to compare temperature profiles of “known good” boards to “suspect” boards and indict bad ICs in the depot repair environments.  When known good boards are not available thermal profiles can be interpreted against a preset limit set in the software.  Seica is the first flying prober OEM to introduce this feature on its line of flying probers.  Introducing thermal sensors with the traditional features already present on flying probers such as; in-circuit, functional, boundary scan, power up test...makes the flying prober a continuing evolving test tool to satisfy the demanding test needs of the production and depot repair markets. In the market today there are instances of large 'bone piles' of boards that require many hours of debug and testing by skilled senior technicians or engineers to return them to operational condition. The pyrometer spot size allows for precise thermal measurement of the IC die or other components while the part is powered up even under low voltage conditions.  The simplicity of a thermal profile test can help reduce labor repair cost and improve inventory turnover. 

Salem, New Hampshire, February 2010 -- Seica Inc, a leading supplier in test and production solution, will be featuring, once again, their latest advanced and emerging technologies in printed board design and manufacturing, electronics assembly and test, such as: 
The AERIAL M4 is the cost-conscious solution for those who seek the highest flexibility from a flying probe tester, from production test to repair, all the way to reverse engineering.
“The AERIAL represents the simple, immediate solution to those customers who need to implement a test strategy that is cost-effective and is very easy to program and operate, even for non-specialized personnel”, says Antonio Grassino, President of Seica.
The AERIAL M4 has a vertical architecture with two flying test probes on each side, two additional Openfix probes and two cameras (one on each side respectively). This configuration allows the Aerial M4 to perform true in-circuit tests, giving full access even to boards that do not have all the test points on one side only. The system also has the  capability to place guarding points, as well as use all of the vectorless test techniques for ICs, with or without powering up the UUT.
On display at the Apex Show in Las Vegas, NV will also be Seica’s Firefly laser selective soldering system. Over the past few years this new technology has been making in-roads into the military sector where, due to contract obligations or restrictions on re-designs, there has been regained interest in new, effective soldering solutions.

Due to the fine pitch solder capability of Seica’s laser system, when new production builds are being contracted out, some of the previously difficult solder operations are being reviewed against the latest solder process technology. This not only improves the quality of the finished product to the end user but can also improve efficiency and costs to the contract manufacturer or OEM. Companies look at ways to reduce costs so it is worth reconsidering the new automated solder process associated with laser technology.

Being one of the top notch soldering systems currently on the market, here are the latest innovative features of the system:

• Uses lead-free solder
• Board and components are soldered correctly, without undesirable thermal stress
• Laser technology allows a non-contact soldering process
• The accuracy of the thermal process ensures high quality of solder joints
• High level of process flexibility in all applications
• Can solder a wide range of components; i.e. through hole components, pin grid array, odd form components, RF shielding and connectors

The Pilot V8 represents the latest frontier in flying probe test technology and is the complete solution for those who want maximum performance: the highest test speed, low to medium volume, test coverage and flexibility, for prototyping, manufacturing, or repairing any type of board. We will demonstrate the latest updates on Pilot V8 on video at Apex.
With 8 electrical flying test probes (4 on each side), 2 Openfix flying probes (1 on each side), 2 power flying probes (1 on each side) and 2 CCD cameras (1 on each side), the Pilot V8 has 14 mobile resources available to test the UUT, all included in a vertical, very compact and robust architecture, making Pilot V8 unique in its genre. The system also includes statistic functions and procedures of the retest of the failures.

New at Apex 2010:
Aiming to further enrich its range of solutions for the test and repair of electronic boards, Seica, in partnership with Temento Systems, has developed the FlyScan module as a new approach to the integration of the boundary scan technique and flying probe test systems. The true innovation of FlyScan is today available on the complete line of Pilot/Aerial flying probe testers, it’s full integration at the core system level, ensuring the following capabilities at a competitive price:

• Automatic generation of the test program in a single software environment (Seica VIVA)
• Automatic creation of the boundary scan program also for nets which are not of the JTAG type, using the “extended test” function and the flying probes to transform them into “JTAG testable” nets
• Automatic elimination of test redundancies
• Automatic fault diagnostics, with real-time generation of additional tests executed by the flying probes for the specific identification of the faulty component.
• A single test report in the VIVA environment
• Management of the faults detected by the boundary scan test in the Seica Repair Station environment