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Nuremberg, June 8-10 - We are waiting for you at show and Conference

"Reverse Engineering and Flying probe Platform", June 8, h 14.00

Our road is passing through SMT ...

SMT ended with an extremely positive assessment for SEICA SPA. We hosted in our booth new Customers highly interested in the new technologies introduced. A great reconfirmation for the renewed Flying Probe, line, with its new applications and capabilities, and enthusiasm for the laser selective soldering line where our Company is an exclusive leader.

Luca Corli’s press conference: “Reverse Engineering and Flying probe Platform” drew a great interest. We propose a brief summary of what has be presented on Tuesday, June 9th 2010, at 2 p.m at CCN Ost Raum Istanbul, Ebene 2/room Istanbul, Level 2. 

 

 

“Reverse Engineering and Flying probe Platform”

In the electronic industry Reverse Engineering is normally defined as the process of discovering the technological principles of a device, object or system through analysis of its structure, function and operation. Talking about electronic board test with ATE (Automatic Test Equipment), where normally CAD data, schematics and BOMs are requested today to generate a test program, in case of loss or lack of that documentation a reverse engineering process can be adopted to extract enough information (netlist) from a golden sample, in order to make a comprehensive test program with a reasonable test coverage. This program, written in a very short time and without a full knowledge of UUT (Unit Under Test) functions, could be very useful to allow repair of faulty boards coming from the field, or to filter good and bad boards from an unknown batch of boards.  The Seica double side flying probe testers, belonging to the PILOT line and equipped with a suitable set of dedicated software, can be the best ATE to run both reverse engineering and test, thanks to the combination of visual inspection capabilities and “net oriented vectorless testing methods”.

Aiming to further enrich the range of capabilities available on its Flying Probe Systems, which have been proposed for more than 15 years as a complete platform for any type of electronic board, SEICA has recently introduced on the market other new modules to equip the complete PILOT LINE systems: FlyScan, Thermal Scan and Quick test.

FlyScan represents the true integration at a core system level of boundary scan technique and a flying probe system, offering the user unique performances, combined with low costs and very short time needed for test development, compatible with the requirements of of those who wish testing their products in real time.

Thermal Scan allows the monitoring in a fully automated way the temperature of each electronic component when it is powered by the flying probe ATE a, hence to detect faults by comparing the temperatures of a working sample and the lot of boards to be tested also in lack of schematics or CAD data. Thermal Scan as for any other test technique available on Seica systems, can be integrated in a comprehensive test program managed by the VIVA software.
Quick Test represents the true innovation in flying probe for the functional test: it is a powerful and intuitive graphic software allowing the implementation of functional test without knowledge of the hardware system architecture, only the functional specifications of the UUT are required, which can be easily and quickly input in a VIVA in-circuit program.