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Nepcon Shanghai - China

As all years SEICA China took part at the most important Chinese electronics exhibition, Latest updates on Test Systems and manufacturing Solutions

Seica SpA Will Showcase Latest Updates on Test Systems and Manufacturing Solutions at Nepcon Shanghai,  April 20th-22nd, 2010 Hall 1, Booth 4F01 

 
Strambino, Italy, March 2010 - Seica's innovative test solutions are being used across the globe to improve quality, increase productivity and save money in automobile, military and consumer markets.  The leading supplier in test and production solutions, will be featuring, once again, their latest advanced and emerging technologies in printed board design and manufacturing, electronics assembly and test, such as:

Flying Prober Pilot VIP
The Pilot VIP represents the best solution for those wishing to fully automate the flying probe test process, eliminating the need for continuous operator presence in order to manage the test system. Thanks to its integrated SMEMA conveyor, the Pilot VIP can be combined with automatic load/unload magazines or lines, executing in-circuit/functional/visual tests of electronic boards in a completely automated mode, integrating all its measurement capabilities and techniques in a single test program.

The horizontal architecture of the Pilot VIP, which includes the automatic conveyor and board clamping system, also enables the use of frames/carriers and/or support fixtures which facilitate the use of fixed channels, Openfix  sensors and power connections in order to maximize  test program fault coverage. These fixed resources are positioned on the elevator platform under the UUT, which enables them to be applied in the automatic mode with no need for further operator intervention.

Its 610 x 610 mm test area allows Pilot VIP to handle even big boards or board panels, and the extensive expandability of the ATE rack can hold up to 1032 analog channels, connectable to an external bed of nails test fixture (TPM) coupled to the system. In fact, the VIP SW platform allows the user to run the same test program using the flying probes or a bed of nails fixture, depending on his production requirements.

New at Nepcon Shanghai - FLYScan Module

Aiming to further enrich its range of solutions for the test and repair of electronic boards, Seica, in partnership with Temento Systems, has developed the FlyScan module as a new approach to the integration of the boundary scan technique and flying probe test systems. The true innovation of FlyScan is today available on the complete line of Pilot/Aerial flying probe testers, it’s full integration at the core system level, ensuring the following capabilities at a competitive price:

• Automatic generation of the test program in a single software environment (Seica VIVA)

• Automatic creation of the boundary scan program also for nets which are not of the JTAG type, using the “extended test” function and the flying probes to transform them into “JTAG testable” nets

• Automatic elimination of test redundancies
• Automatic fault diagnostics, with real-time generation of additional tests executed by the flying probes for the specific identification of the faulty component.

• A single test report in the VIVA environment

• Management of the faults detected by the boundary scan test in the Seica Repair Station environment

PTE 100
Intelligent Break-Out Box Based on Seica’s standard VIP architecture, including the DSP ACL module, the PTE-100 combines the features of different instruments like voltage generator, current generator, waveform generator, voltmeter, amperometer, frequency meter and oscilloscope, with the typical features of an automatic test system.  It is also equipped with a mid-range power relay matrix (500V @2A) with switching and interrupt functions of up to 256 input/output channels.

The PTE-100 is ideal for diagnosing and identifying in field faults in the electronic systems aboard helicopters, trains, planes and systems made up of electronic modules interconnected through cables equipped with break out connectors. The PTE-100 is connected between two modules to monitor the activity present on the interconnect cable, and can execute stimuli/measurement operations as well as simply connect/interrupt every single wire of the cable itself, to facilitate the diagnosis of the problem by an expert user.