With global battery markets growing in double digit percentages, testing of batteries (cylindrical, prismatic, or pouch), and their corresponding battery packs, is a main concern of many OEMs, integrators, and new start-ups. The needs to increase production throughput, improve reliability of the packs produced while optimizing the cost of battery pack testing are major challenges faced by today’s
Seica, Inc. – Haverhill, MA – Don’t miss Seica’s Pilot Battery Tester (PILOT BT) demonstration at The Battery Show in Novi, Michigan, September 14-16, in booth 3036! Seica will demonstrate the testing of battery cells in an inline test configuration with its Pilot BT. With its impressive parallel testing architecture, the Pilot BT can test
PILOT BT is the Seica series of flying probe test systems designed to test full-size EV lithium-ion battery packs, and is able to meet the most complex technical needs of battery manufacturers. This Seica test solution has the capability to test, with maximum accuracy, the interconnections (bonding resistance) of Prismatic and Cylindrical cells present in
Seica takes part at Robotic Soldering – when does it make sense? – Robotic soldering is quickly becoming more affordable and effective in electronics assembly. This panel will discuss the latest developments and benefits of introducing this key technology.
It is now three decades since Seica’s Flying probe platform was introduced. Seica has fully embraced the concept of Industry 4.0 developing solutions now also promoted by Canavisia to monitor and collect information from machines and industrial plants. see Test&Measurament article
Seica is pleased to invite to the Webinar June 10 – Register Now In the world of electronic board test, for many years flying probers have been considered good enough for prototype testing only, but today some of them can achieve unprecedented high performances in terms of quality and throughput, becoming a perfect solution also for
Starting with the basics and the mechanical designs associated with probe cards and their construction, the very first constraint a user may notice is the size of the cards themselves. Traditional flying probe test area sizes can be a limiting factor, so much so, the probe cards don’t even fit in the test area. To
The latest fixtureless technology available for even the most challenging Probe Cards To watch our webinar where we talk about Probe Card Test, please contact us at mktg@seica.com The wafer fabrication is a sequential process that gradually creates the electronic circuit. By simplifying, during the manufacturing process of silicon wafers, several integrated circuits are placed
Following the boost to energy saving and the improved design technology, the LED type components replaced almost any other light source. LED modules can be found in any market sector, starting from Automotive, bringing production levels of this type of boards to unconceivable amounts. Typically we talk about simple boards from a circuitry point of
The new FlyPOD option by Seica allows to connect multiple hardware resources to a mini fixture which is installed directly on one of the flying probes. The complexity and miniaturization of electronic boards leads the market to an increasingly widespread deployment of flying probe testers which are turning from parametric testers into powerful and flexible general
