Laser Selective Soldering

Seica has its own line of Laser Selective Soldering systems, the FIREFLY Line. 

DIFFERENT ARCHITECTURES FOR DIVERSE SOLUTIONS

The soldering head, which is the core of the system, is common to both the Firefly T60 and B60 machine configurations. The two solutions are mainly distinguished by the side of the board where processing is performed: the TOP solution and the BOTTOM solution, discover more:

Laser Selective Soldering

FIREFLY T60 & B60

Firefly introduces a laser beam which is orthogonal to the solder joint, and the donut spot, to improve the focusing of laser energy where required, and offering suitability for very small-sized pads providing clear advantages in terms of applicability and process repeatability. A minimized footprint, efficiency and cleanliness (low maintenance), accompany a flexible, monitorable and certifiable soldering process, making the Firefly Selective Soldering System the ideal soldering solution to resolve manufacturing issues, both in EMS (Electronic Manufacturing Services) and OEM industries, such as Automotive.

Flexible and always monitored process, the Firefly Line is the answer to the manufacturing needs, through the clean and efficient laser technology.
The modularity of Firefly systems provides an enhanced integration on the existing production lines: both top and bottom soldering modules are available depending on the production requirements.
The experience achieved in the flying probe test systems, enabled the successful integration of the VIVA software with a complete management of motion of the soldering alloy distribution, as well as the management of power transfer. A line of systems capable of resolving the issues of process automation is born.
Repeatability and flexibility make the Firefly system ideal both for electronic boards manufacturers and sub-contractors.

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For more information: sales@seica.com