SEICA CHINA is pleased to invite you to visit Booth 11A02 at NEPCON ASIA 2025, important exhibitions in the electronics manufacturing industry, taking place from October 28–30, 2025, at the Shenzhen World Exhibition & Convention Center.
Seica will showcase renowned Flying Probe PILOT Platform with the PILOT VX system, Seica’s flagship. Will also introduce latest innovations in terms of functional and in-circuit test, and AI-driven process optimization, highlighting the company’s commitment to delivering Smart, Innovative and Integrated Test Solutions for the electronics industry.
At booth 11A02, visitors will experience the PILOT VX, known and appreciated for its speed, precision, and versatility. The VX features state-of-the-art mechanical architecture and motion controllers that reduce test time by up to 50%. With 12 multifunctional test heads, it can probe both sides of the board with up to 60 points simultaneously. The advanced measurement hardware and a new microwave-based measurement technique deliver unparalleled test performance. This platform, with unique options such as FlyPod and FlyStrain, along with the optimized VIVA software, is recognized as the benchmark for flying probe speed and performance. VIVA’s intelligent management capabilities further improve efficiency by parallelizing different test types, while AI-based smart analysis can automatically optimize the test flow in real time.
In addition to the solutions on display, Seica is promoting the PILOT VX XL HR, a revolutionary flying probe test system designed for comprehensive probe card testing. This vertical platform integrates hardware and software to perform multiple tests, including pre-assembly MLO and PCB board testing, in-circuit (ICT) and functional testing after assembly, and final probe card verification. Equipped with high-resolution cameras and an ultra-fast capacitive measurement system, the PILOT VX XL HR delivers highly accurate electrical measurements while significantly reducing test times. To accommodate the increasing complexity of probe cards, the XL version supports boards up to 900 x 630 mm, with an optional upgrade for thicknesses up to 12 mm. These enhancements ensure that Seica’s flying probe technology remains at the forefront of semiconductor and PCB testing.
To further highlight the potential and value of latest-generation automation, we invite you to see “SMART & FAST FLYING PROBES TEST LINE video”, a case study of a fully automated line that uses an intelligent conveyor system and latest-generation software infrastructure to centrally integrate and manage the testing activities of six Flying Probe Pilot VX systems. Automation pervades every operational phase, from the management (handling and testing) of the boards to the control of the status of the equipment, right through to the analysis and archiving of data.
The entire system is controlled by VIVASoftware, equipped with the Line Supervisor Manager module, which optimizes the use of test systems based on their status (free or busy) and monitors and synchronizes their activities according to production priorities.
Discover all the details in the Seica video:
At Booth 11A02 Seica Experts will provide all information on Seica’s Valid platform, renowned for its high performance in in-circuit and functional testing using a bed-of-nails which is coming onto the market with Valid SL system.
The VALID SL is Seica’s new fully automated bed-of-nails test solution, designed for seamless integration into high-volume production lines. Its cableless architecture ensures long-term signal integrity and reliability, while new 128-channel scanner cards enable configurations exceeding 4,400 channels, ideal for the most complex test requirements. With an expanded test area, available in single- or dual-stage configurations, and a multi-job architecture supported by the new VIVA™ interface, the VALID SL offers exceptional ergonomics, easy maintenance, and optimal usability for both programmers and operators.
