The PILOT NEXT>SERIES systems integrate new, improved RGB lighting: the advanced ﬁlters and color programming options allow the user to achieve the best conditions for automatic optical veriﬁcation of component and solder presence.
VIVA NEXT> software can call , during test program execution, functional test sequences written using third party languages: for example Labview, VBScript, Python, and C, allowing the user maximum test flexibility. The PILOT NEXT>SERIES systems also offer fully integrated On Board Programming solutions, applied to the UUT via the mobile system
The Automated Laser Inspection option provides an accurate measure of the height of objects, providing an additional test for presence/absence of component bodies, PCB thickness and warpage measurement. Fast and reliable, it can be also applied to any mechanical assembled part on the PCB. Available for both Top and Bottom sides.
The LED sensor option is used for testing the LEDs present on the UUT. The UUT is powered on, and the LED sensor measures luminosity, color, saturation and frequency spectrums of the LEDs, operating in the visible and infrared light range of wavelengths.
The PILOTNEXT>SERIES systems include a series of hardware and software features and performances to support full traceability of the test results of each single UUT: the cameras automatically read 2D barcodes allowing test results to be stored for each board, making them available for subsequent repair operations, statistical analysis, etc., whether locally, via the resident repair station module, or to external information systems.
The architecture of the PILOT NEXT>SERIES offers the possibility to execute parallel testing of two single or double-side boards. This capability has a significant impact on test throughput, doubling it in the first case, and in the second case, achieving a significant increase, as well as the ROI of the test system.
The PILOT NEXT>SERIES systems are equipped with high deﬁnition color cameras which, together with new, sophisticated software algorithms, enable an advanced level of optical inspection of the UUT, complementing the electrical tests with the veriﬁcation of presence/absence, polarity.
The thermal Scan module verifies the operating temperatures of the circuits and components on the UUT, comparing them to the temperature profile acquired on a powered on sample board. Like all other test techniques available in VIVA NEXT>, thermal scan tests are fully integrated into the complete test program for the specific board.
The optional UUT test marker can be installed on any PILOTNEXT>SERIES system, for visual test traceability and subsequent identification purposes.
During the last decade, flying probe test have continued to evolve and now offer such a wide range of performances, that it is sometimes difficult for the user to choose the most suitable architecture and configuration.
Born about 30 years ago in the midst of general skepticism, especially from electrical test engineers, flying probe test systems are now considered worldwide as fundamental and essential tools to test all types of of electronic boards. The significant market share that flying probe testers have conquered over the years, is beyond all doubt due to the constant demand for more flexibility and cost savings of electronics manufacturers, always seeking advanced tools and equipment to certify the quality of their products and at the same time cope with the reduced life cycles imposed by a frenetic market constantly eager for news.
The initial prerogative that roused the interest towards flying probe testers was certainly the lack of fixtures dedicated to a specific kind of board and hence the possibility to set up test programs without the recurring costs needed to build up a specific bed of nails destined to die along with the product to be tested. This is still one of the biggest advantages that can make a flying probe system more desirable than a traditional bed of nails in-circuit system. But the “brave” users, or, better, the farsighted ones, who successfully tried out a flying probe system about ten years ago , gradually came to realize their great potential and began to require higher and higher performances, inducing the test systems manufacturers to invest significantly in the research and development of new measurement, mechanical motion and software technologies to enrich the flying probe testers with new functions. This great technological effort has produced results that were inconceivableuntil a few years ago, transforming the flying probe tester used for simple MDA testing of passive components into a real multifunctional test platform, providing the user with several advantages in terms of speed, reliability, fault coverage and cost of test.
However, as often happens when a type of equipment has undergone years of development , and improvements, and becomes a mature technology, the range of offers available become so wide and varied that the choice is made more and more complicated for the end user.
Those that are considering the purchase of a flying probe test system today must make strategically important and often not obvious choicesconcerning the system architecture strictly depending on the test requirements of the customer himself. To choose the most suitable architecture, it is important to know, with good approximation, what and how is to be tested, but it is often enough to have a couple of clear ideas that serve to orient the choice towards the best solution.
, are typically the environments where are implemented. The Seica VIP platform software, , common to all of the systems, allows a completely versatile test approach, from simple ICT to functional tests, from automatic, net-oriented tests to the reconstruction of the data and electrical schematics of boards coming from the field.
the evolution of the test algorithms and strategies present in the VIVA software mean that the testers provide fast, high performance production testing. The diverse, integrated test technologies such as optical inspection, thermal analysis, boundary scan, power-on functional test, and the possibility to include other processes such as On-Board Programming (OBP), allow the user to streamline the various production phases, optimizing process time.
There are different types of requirements for diagnosing faulty boards, depending on the characteristics of the boards themselves and the specific repair situation (manufacturing defects, field returns, repair depot, etc.).
The line has an extensive tool set developed to address all of the repair scenarios, and the intrinsic flexibility of the flying probe test approach allows the user to implement from one to all of the test techniques available, to optimize the repair process and results.
by exploiting the versatility of the hardware and software, it is possible to obtain immediate data from the testing of prototypes, avoiding costs and time for building preliminary fixtures or test benches, ensuring maximum fault coverage in the minimum time.
the necessity of managing field returns is a constant in today’s industy, and in some sectors, such as transportation, infrastructure, communication and defense, the repair returns are often older boards which do not have complete documentation, schematics or construction data. The double-side solutions offered in the line are ideally suited to carry out reverse-engineering operations, and include all of the necessary software tools to enable the reconstruction of the electrical schematics and the CAD data of the board under repair.