Firefly Next> series – Laser Selective Soldering

The advantages of laser

• Allows point by point adjustment of  the power needed for soldering; the lack of thermal inertia of the laser combined with real-time temperature readings, enable the dynamic correction of the thermal profile.

• Allows point by point adjustment of  the power needed for soldering; the lack of thermal inertia of the laser combined with real-time temperature readings, enable the dynamic correction of the thermal profile.

• The orthogonal position improves the energy transferm The donut beam allows to radiate energy only on the pad and not on the hole, preventing damages to components and harmonizing the temperature of pin and pad.

• The ability to apply all of the energy in a single point makes this technology applicable in all those situations where it is not admissible to heat the whole board, or where there is limited access.

• Changing from “Lead” to “Lead-Free” soldering is simply a matter of changing a spool of solder wire.

• The laser soldering process is clean, which eliminates the need to clean, and subsequently handle, the processed boards,  and the power consumption of the Firefly is extremely low compared to other types of soldering technologies.

• The Firefly systems are ready to solder as soon as they are switched on, without preheating, making them an extremely flexible tool in a manufacturing environment.

Diverse Solutions

The soldering head, which is the core of the system, is common to both the Firefly NEXT>Series B60 and T60 NEXT>Series machine configurations. The two solutions are characterized mainly by the side of the board where processing is performed: the BOTTOM solution, where the soldering process is carried out from below the PCB, and a TOP solution, where the soldering process is carried out from above the printed circuit board. This configuration is particularly suitable for automated processes where the system is integrated into an existing conveyor line.

The Firefly NEXT>Series soldering systems can be successfully integrated into high-volume production lines, as well as in those cases where the products to be soldered are continuously changing and Lead” and “Lead-free processes are often mixed.

Process traceability

Process traceability is ensured by the possibility to collect the video recording and thermal profiles acquired for every solder joint, and to associate them to the serial number of the printed circuit board. The collection of this data is also valuable as a debug tool of the soldering process.

Environment-friendly

With a maximum power absorption of 2.5 KW/h, the Fireflyfly NEXT>Series is easy to manage and maintain. In addition, the utilization of flux-based soldering alloys eliminates the need to use external fluxing stations, as well as the necessity for nitrogen. The consumption of solder alloy is limited to the amount applied to each joint, generating zero waste and eliminating disposal costs.